pb lead-free parts ligitek electronics co.,ltd. property of ligitek only led array la38b-97/h-pf data sheet doc. no : qw0905-la38b-97/h-pf rev. : b date : 13 - aug. - 2009 l dcc
ligitek electronics co.,ltd. property of ligitek only package dimensions 1/5 la38b-97/h-pf page part no. lh2043/f697-pf note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 3.0 4.0 4.2 5.2 4.50.5 6.0 4.0 3.50.5 2.54typ ?? 0.5 typ + - ?? 0.5 typ 2.54typ + - 4.0 3.0 4.50.5 5.2 4.2 1.0min
-40 ~ +100 tstg storage temperature forward voltage @20ma(v) luminous intensity @10ma(mcd) spectral halfwidth ??f nm viewing angle 2 c 1/2 (deg) material peak wave length f pnm part no note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. gap la38b-97/h-pf 8.0 typ. 697 red water clear 4.5 2.6 1.7 90 emitted lens min. max. min. 30 typical electrical & optical characteristics (ta=25 j ) color j page 2/5 part no. reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 j forward current power dissipation parameter 15 ma i f t opr ir -40 ~ +85 10 pd i fp 40 60 j g a ma mw symbol h ratings unit ligitek electronics co.,ltd. property of ligitek only la38b-97/h-pf
1.5 relative intensity@20ma normalize @25 j forward voltage@20ma normalize @25 j ambient temperature( j ) 1000 900 800 700 600 wavelength (nm) fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma 0.0 0.5 1.0 0.8 -40 0.9 -20 0 20 40 60 80 100 -40 0.0 1.0 0.5 -20 80 40 20 060100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) fig.4 relative intensity vs. temperature forward voltage(v) fig.3 forward voltage vs. temperature 1.1 1.0 1.2 forward current(ma) 0.1 1.0 1.0 100 10 1000 2.0 3.0 2.0 3.0 2.5 relative intensity normalize @20ma 4.0 5.0 1.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage h chip part no. 10 100 1000 page 3/5 la38b-97/h-pf
ligitek electronics co.,ltd. property of ligitek only part no. page 4/5 la38b-97/h-pf 60 seconds max 0 preheat 0x 25x 2 /sec max 100 50 150 time(sec) temp(c) 120x 260x 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above.
ligitek electronics co.,ltd. property of ligitek only reliability test: part no. 5/5 page la38b-97/h-pf reference standard description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition test item 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 high temperature storage test low temperature storage test operating life test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 solderability test high temperature high humidity test solder resistance test thermal shock test
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